IEEE Global Engineering Education Conference (EDUCON)
Co-organized by IEEE Education Society, IEEE Region 8, IEEE Romania Section, IEEE Romania Education Chapter and Politehnica University of Timisoara, Romania
The IEEE Global Engineering Education Conference (EDUCON) is one of the flagship conferences of the IEEE Education Society. EDUCON 2027 is the 18th in a series of conferences that rotate among central locations in the IEEE Region 8 (Europe, Middle East, and Africa).
Held annually since 2010, EDUCON provides an opportunity for scientists, professional engineers, practitioners, and students to present their work, publish their results, exchange ideas, and network for future scientific and industrial collaborations.
The EDUCON conference offers academic, research, government, and industry professionals a platform to facilitate the advancement of engineering education, as a renowned international forum for collaboration, networking, learning, and sharing the latest advancements in education. Accepted and presented papers will be submitted to the IEEE Xplore® Digital Library for publication and will appear in the Conference Proceedings Citation Index (CPCI)—an integrated index within Web of Science, SCOPUS.
Main Theme
Engineering Digital Education Ecosystems: Harnessing AI, XR, Cybersecurity, and Emerging Technologies for the Future of Education
Include subthemes dedicated to education technologies, microcredentials, the use of AI, the role of digital education into the development of innovative engineering education, the role European Universities Alliances play in education.
The theme positions EDUCON 2027 as a leading forum addressing critical global issues through innovative educational approaches, digital transformation, digital ecosystems, technological advancement, and sustainable development. Digital transformation is reshaping education into an increasingly interconnected ecosystem where artificial intelligence, cybersecurity, immersive technologies, mixed reality, blockchain, data-driven learning, and intelligent digital platforms are becoming integral to teaching, learning, assessment, and institutional development.
The EDUCON conference theme, “Engineering Digital Education Ecosystems: Harnessing AI, XR, Cybersecurity, and Emerging Technologies for the Future of Education,” explores how engineering education can responsibly design, integrate, and govern these technologies to create innovative, secure, inclusive, and sustainable learning environments.
Beyond individual technologies, the conference encourages a systemic perspective on education as a digital ecosystem, connecting learners, educators, institutions, research, industry, communities, platforms, and data. Contributions are particularly encouraged that demonstrate how technology can improve educational quality, accessibility, personalization, collaboration, employability, and lifelong learning while addressing ethical, security, privacy, sustainability, and human-centered design consideration for future-ready digital education ecosystems capable of supporting the evolving needs of engineering education and society.
Main Themes
Artificial Intelligence, Generative AI and Intelligent Learning Ecosystems
XR, Digital Twins and Immersive Technologies for Education
Cybersecurity, Data Protection and Trustworthy Digital Education
Innovative Teaching, Learning and Assessment in Engineering Education
Open, Online, Mobile and Flexible Education
Microcredentials, Digital Credentials and Lifelong Learning Pathways
Digital Education Ecosystems, Platforms and Interoperability
Engineering Education for Industry 5.0, Entrepreneurship and the Future of Work
Sustainable and Green Engineering Education
Leadership Development for Women and Youth in STEM
Global Collaboration, Mobility and Digital International Education
Future Universities, European Universities Alliances and Digital Transformation
Type of Submissions
The initial submission is a structured abstract for a Full Paper or Short Paper, reporting original research of a theoretical or applied nature, via the online submission system, EDAS. The Abstracts should be of 250 words and express clearly the purpose, topic and main results of your future paper.
Authors will submit camera-ready Full papers, Short papers, Posters, Panels, Workshops, or Special Sessions (Full, Short, Posters).
Publication in IEEE Xplore® for the accepted full and short papers, posters and workshops/panels will be published only based on full submission and review.